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D224

NVIDIA Jetson Orin NX Industrial Edge AI Box EA250Pro

Name: NVIDIA Jetson Orin NX Industrial Edge AI Box EA250Pro
Brand: Beilai Tech. Co., Ltd.
SKU: EA250Pro

No.EA250Pro

EA250Pro: rugged industrial edge AI box with Jetson Orin NX, up to 157 TOPS, 4-camera input options (4× GbE, 4× GMSL2, or 4× MIPI CSI-2), 8K decode, Y-series IO, -20 to +75°C.

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Description
Model Selection

NVIDIA® Jetson Orin™ NX Platform

High-performance edge AI,
modular for every sensor

EA250Pro delivers up to 157 TOPS of INT8 AI performance from an 8-core Arm Cortex-A78AE CPU and 1024 CUDA cores. With 8K30 decode, 4K60 encode, modular camera inputs and Y-series IO, it runs the most demanding multi-sensor edge workloads on-site.

157 TOPSINT8 AI

8-coreCortex-A78AE @ 2.0 GHz

8K30 / 4K60Decode / Encode

-20 / +75 °COperating

Why EA250Pro

Built for complex multi-sensor, high-performance edge AI

Six reasons engineers choose the EA250Pro for the most demanding industrial workloads.

Up to 157 TOPS for the toughest models

Run YOLO, segmentation, pose estimation, 3D point cloud processing or a lightweight LLM/VLM entirely on-device. The Orin NX module delivers up to 157 TOPS INT8 with 8/16 GB LPDDR5.

1024 CUDA cores · 32 Tensor Cores · 10–40 W configurable

8K decode, 4K encode — all in hardware

Decode 1× 8K30, 2× 4K60 or 9× 1080p60 H.265 streams, and encode up to 1× 4K60 or 3× 4K30. Ideal for multi-camera inspection, video analytics and real-time streaming at the edge.

1× 8K30 / 2× 4K60 / 4× 4K30 / 9× 1080p60 decode

Four camera inputs, three ways to connect

Pick the interface that matches your sensors: four additional Gigabit Ethernet ports, four GMSL2 deserializers with PoC over FAKRA Z, or four MIPI CSI-2 channels via 22-pin FFC. One module at a time, so you only pay for what you need.

VD01: 4× 1GbE · VD03: 4× GMSL2 · VD05: 4× MIPI CSI-2

Y-series IO: scale from 4 to 30+ channels

A dedicated Y-slot accepts digital, analog, RTD, thermocouple, RS-485/232, CAN-FD and PWM modules. Build exactly the I/O your machine needs — up to 2× CAN-FD, 4× RS-485, 16× DI, 8× DO, plus GPI/GPO.

Y01–Y96 modules · 16 DI / 8 DO / 4 AI / 4 AO / RTD / TC / PWM

Rugged enough for the factory floor

An all-aluminium chassis with passive cooling and an optional speed-controlled fan, rated from -20 °C to +75 °C, fed by a 12–24 V wide DC input. Immunity tested to EMC level III.

IP30 · CE / FCC · Optional fan kit

Service without a site visit

The optional out-of-band module lets you power-cycle or reboot over Ethernet, Wi-Fi or 4G — even when the OS is unresponsive. Perfect for cabinets on a pole, in a tunnel, or hours from the nearest engineer.

OOB power control · Ethernet / Wi-Fi / 4G

Applications

Where EA250Pro is deployed today

Multi-channel visual inspection

ADAS / V2X roadside edge nodes

Humanoid & composite robot controllers

UAV / USV onboard edge computing

Smart traffic holographic perception

Medical imaging AI diagnosis

Energy storage / charging pile scheduling

Edge AI model fine-tuning platform

Specifications

Core specifications

System block diagram

Core hardware parameters

CPU	NVIDIA® Jetson Orin™ NX — 8-core Arm Cortex-A78AE, up to 2.0 GHz
GPU	1024 CUDA cores + 32 Tensor Cores (4th generation)
AI performance	Up to 157 TOPS (INT8) with the 16 GB module / up to 117 TOPS with the 8 GB module
Memory	8 GB or 16 GB LPDDR5
Video encode	1× 4K60 / 3× 4K30 / 6× 1080p60 (H.265)
Video decode	1× 8K30 / 2× 4K60 / 4× 4K30 / 9× 1080p60 (H.265)
Ethernet	2× RJ-45: 1× 1 Gb + 1× 2.5 Gb auto-negotiating; ESD level 3, EFT level 3
USB	2× USB 2.0 Type-A (480 Mbps) · 4× USB 3.1 Gen1 Type-A (5 Gbps)
Display	1× HDMI 2.1, up to 8K@30 Hz
Audio	1× audio out (headphone/line); APE and HDA support; I2S digital audio interface
Storage	1× M.2 Key-M (2280) with PCIe Gen3 x1 for NVMe SSD
Wireless expansion	1× M.2 Key-E (2230) for Wi-Fi 6 / Bluetooth, supporting PCIe, USB and UARTModule sold separately
Cellular	1× Mini PCIe for LTE/5G modem or Wi-Fi, USB 2.0 only — 4G and Wi-Fi are mutually exclusive
Security	Firmware-based TPM 2.0 (fTPM), compliant with the TPM 2.0 standard
Digital I/O	2× isolated GPI (5 V level) · 2× isolated GPO (5 V level)
Serial	1× isolated RS-485, pin-multiplexed with RS-232 (RS-485 by default, RS-232 on request) · 1× isolated CAN-FD
Camera input module	Choose one: VD01 (4× 1GbE RJ45) · VD03 (4× GMSL2, FAKRA Z, PoC) · VD05 (4× MIPI CSI-2 via 2× 22-pin FFC, Jetson Orin DevKit pinout)VD05: uncased design
IO expansion	1× Y-board interface; up to 2× CAN-FD, 4× RS-485, 16× DI, 8× DO, 2× GPI and 2× GPO
Out-of-band	Optional OOB management module with its own Ethernet, Wi-Fi and 4G interfaces (Mini PCIe, USB only)
SIM	1× Micro-SIM slot
Debug / flashing	1× Console USB (USB-C) · 1× USB flashing port (USB-C)
Buttons	Reset · Flash · Power (with power LED)
Power input	12–24 V wide DC input via 2-pin terminal block
Operating temp.	-20 °C to +75 °C
Storage temp.	-40 °C to +85 °C
Dimensions	Standard: 166 × 107.6 × 67 mm · With fan: 166 × 107.6 × 74.6 mm
Cooling	Passive or active; externally speed-controlled fan for enhanced cooling (optional)
Mounting	Bracket mounting, aluminium alloy enclosure
Certification	CE, FCC

Support

Development resources & services

Development resources

System image and root file system image
Kernel driver source code
Complete platform SDK
Getting-started guides and a library of demo programs

Value-added services

Second-development assistance
Custom R&D and manufacturing
Long-term after-sales support

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